Invento i612 Intel Phi Series
Salient Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:-
1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, optional integrated Intel® Omni-Path
fabric, CPU TDP support Up to 260Ws
2. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots
3. 2 PCI-E 3.0 x16 (Low-profile) slots
4. Intel® i350 Dual port GbE LAN
5. 3 Hot-swap 3.5" SATA drive bays
6. 2000W Redundant Power Supplies Titanium Level (96%)
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:-
1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, optional integrated Intel® Omni-Path
fabric, CPU TDP support Up to 260Ws
2. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots
3. 2 PCI-E 3.0 x16 (Low-profile) slots
4. Intel® i350 Dual port GbE LAN
5. 3 Hot-swap 3.5" SATA drive bays
6. 2000W Redundant Power Supplies Titanium Level (96%)
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